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Creep Behavior at Elevated Temperatures of Several Polycrystalline Ni-based Superalloys Strengthened by MC-Carbides
Patrice Berthod, Safa Tlili, Dame Assane Kane

Creep Behavior at Elevated Temperatures of Several Polycrystalline Ni-based Superalloys Strengthened by MC-Carbides

Science & Mathematics Published 2023 Verification Pending

Overview & Synopsis

Conventional casting allows producing componentswith complex geome- tries and coarse grains favorable for good creep-resistance at high temperatures. Their weak points are generally their intergrains and interdendritics boundaries. Introducing carbon and MC-former metals can achieve the development of an intergranular and interdendritic network of eutectic carbides bringing the double benefit of a script-like geometry for the interdendritics cohesion, and of a good morphological and volume fraction stability on long times at high temperature. In this work two kinds of superalloys were obtained by high frequency induction foundry under inert atmosphere. The first ones are nickel-based superalloys reinforced by ZrC carbides. The second ones are also nickel-based alloys but strengthened by (Ta, Hf)C carbides. All were subjected to 3-points bending creep tests at 1100 °C for a maximal induced tensile stress equal to 20 MPa. They demonstrated high resistance despite the test temperature particularly high for superalloys produced by classical foundry.

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Document Information

Document Title Creep Behavior at Elevated Temperatures of Several Polycrystalline Ni-based Superalloys Strengthened by MC-Carbides
Author / Organization Patrice Berthod, Safa Tlili, Dame Assane Kane
Subject & Discipline Multidisciplinary Academic Open Research
Categories Science & Mathematics
Publication Year 2023
License / Rights Open Access / Creative Commons
Resource Verification Listed PDF (Verification Pending)
Original Host Website HAL Open Science (hal.science)
File Format application/pdf (Portable Document Format)
Language EN
Catalog ID DOC-92141
Original Source Link Visit Source Page on hal.science »