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Towards Intelligent Assembly and Manufacturing Environment – Modular ICT Support for Holonic Manufacturing System
Minna Lanz, Eeva Järvenpää, Pasi Luostarinen, Fernando Garcia, Reijo Tuokko

Towards Intelligent Assembly and Manufacturing Environment – Modular ICT Support for Holonic Manufacturing System

Science & Mathematics Published 2012 Verification Pending

Overview & Synopsis

This paper discusses the possibilities of a modular and more transparent knowledge management concept for a holonic assembly and manufacturing environment that enhances representation of past and present status of the production system thus allowing autonomous reasoning to be applied. The modular ICT approach is developed for a holonic manufacturing system (HMS). The main characteristics of the system are that it is an open system and has characteristics of a complex system. The system itself is an adaptive system, where different services are needed depending on theevolution of the production system itself. The research approach represented here aims to enhance knowledge management and process control by facilitating the move from technology based solutions to conÞgurable systems and processes where the digital models and modular knowledge management systems can be conÞgured based on the need - not based on the closed legacy systems and Þxed process planning. The principles of modularization such as functionalities and interfaces, are used to deal with interactions of the full system.

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Document Information

Document Title Towards Intelligent Assembly and Manufacturing Environment – Modular ICT Support for Holonic Manufacturing System
Author / Organization Minna Lanz, Eeva Järvenpää, Pasi Luostarinen, Fernando Garcia, Reijo Tuokko
Subject & Discipline Multidisciplinary Academic Open Research
Categories Science & Mathematics
Publication Year 2012
License / Rights Open Access / Creative Commons
Resource Verification Listed PDF (Verification Pending)
Original Host Website HAL Open Science (hal.science)
File Format application/pdf (Portable Document Format)
Language EN
Catalog ID DOC-233062
Original Source Link Visit Source Page on hal.science »