Semiconductor Packaging: Materials Interaction and Reliability
Overview & Synopsis
The book focuses on an important step in semiconductor manufacturing - package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance.
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Document Information
| Document Title | Semiconductor Packaging: Materials Interaction and Reliability |
|---|---|
| Author / Organization | Andrea Chen, Randy Hsiao-Yu Lo |
| Subject & Discipline | Electrical and Electronic Engineering, Microcontrollers, PLC, VLSI, etc., Embedded Systems, Electrical and Computer Engineering |
| Categories | Electrical and Electronic Engineering |
| Publication Year | 2017 |
| ISBN | 113807540X |
| License / Rights | Creative Commons License (CC) |
| Resource Verification | Access Restricted / Protected Host |
| Original Host Website |
FreeComputerBooks.com
(freecomputerbooks.com)
|
| File Format | application/pdf (Portable Document Format) |
| Language | ENGLISH |
| Catalog ID | DOC-113746 |
| Original Source Link | Visit Source Page on freecomputerbooks.com » |
Commercial / Print Edition
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Semiconductor Packaging: Materials Interaction and Reliability • Print Edition
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