Thermocompression bonding produces efficient surface-barrier diode
Overview & Synopsis
Thermocompression bonding of a gold wire to a gallium-arsenide wafer produces a quality surface barrier diode with fast recovery times. The properties of this combination may be useful in semiconductor devices.
Indexed from repository: NASA Technical Reports Server
(
ntrs.nasa.gov)
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Document Information
| Document Title | Thermocompression bonding produces efficient surface-barrier diode |
|---|---|
| Author / Organization | National Aeronautics and Space Administration (NASA) |
| Subject & Discipline | OTHER |
| Categories | Aerospace & Aviation |
| Publication Year | 2019 |
| License / Rights | Public Domain / NASA STI Open Access |
| Resource Verification | Listed PDF (Verification Pending) |
| Original Host Website |
NASA Technical Reports Server
(ntrs.nasa.gov)
|
| File Format | application/pdf (Portable Document Format) |
| Language | EN |
| Catalog ID | DOC-79098 |
| Original Source Link | Visit Source Page on ntrs.nasa.gov » |