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The effect of post cure temperature on fiber/matrix adhesion of T650/Cycom 5320-1 using the micro-droplet technique
Nassim Rahmani, Bethany Willard, Kevin Lease, Ephriem T. Legesse, Seyed A. Soltani, Suresh Keshavanarayana

The effect of post cure temperature on fiber/matrix adhesion of T650/Cycom 5320-1 using the micro-droplet technique

Aerospace & Aviation Published 2026 Verification Pending
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Indexed from repository: NASA Technical Reports Server (ntrs.nasa.gov)

Document Information

Document Title The effect of post cure temperature on fiber/matrix adhesion of T650/Cycom 5320-1 using the micro-droplet technique
Author / Organization Nassim Rahmani, Bethany Willard, Kevin Lease, Ephriem T. Legesse, Seyed A. Soltani, Suresh Keshavanarayana
Subject & Discipline ACCEPTED_MANUSCRIPT
Categories Aerospace & Aviation
Publication Year 2026
License / Rights Public Domain / NASA STI Open Access
Resource Verification Listed PDF (Verification Pending)
Original Host Website NASA Technical Reports Server (ntrs.nasa.gov)
File Format application/pdf (Portable Document Format)
Language EN
Catalog ID DOC-24069
Original Source Link Visit Source Page on ntrs.nasa.gov »